USP-12B01 packaging information reference pattern layout dimension note : reference metal mask design unit: mm packaging information / reference pattern layout dimensions
USP-12B01 reel taping specifications taping specifications unit: mm 3,000pcs/reel r type :[device orientation : right] standard feed 11.41.0 20.5 130.2 (1.5) 9.00.3 ( 1.0) +0.1 -0 1.5 4.00.1 2.00.05 (0.80) (0.25) 4.00.1 (2.75) direction of feed
USP-12B01 power dissipation power dissipation data for the USP-12B01 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. test condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm (1600 mm2 in one side) board structure: inner two metal layers, no large metal area in the front and back. copper area 1st inner metal layer about 50% 2nd inner metal layer about 50% each heatsink back metal is connected to the inner layers respectively. material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 2 x 0.8 diameter (one through-hole connection per one heatsink back metal) 2. power dissipation vs. ambient temperature 1 1ch operation board mount (tj max = 125 ) 2 2ch operation board mount (tj max = 125 ) evaluation board (unit: mm) 166.67 thermal resistance( /w) 125.00 thermal resistance( /w) 320 800 power dissipation pd mw 85 25 a mbient temperature 240 600 power dissipation pd mw 85 25 a mbient temperature pd vs ta 0 200 400 600 800 1000 25 45 65 85 105 125 ambient temperatureta pd vs ta 0 200 400 600 800 1000 25 45 65 85 105 125 ambient temperature ta
USP-12B01 USP-12B01 perspective rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??? ?? lead pad nickel ?I au ? ?? outer pad plating gold plating except the side of the terminals. ? ? die attach epoxy ???? au bonding wire ?? silicon chip ?? `` marking laser marking si ver.04
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